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TCL Packaging installs Rofin-Baasel system for perforation

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TCL Packaging installs Rofin-Baasel system for perforation

November 02
11:47 2013
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TCL Packaging has worked with with Rofin-Baasel UK to develop a turnkey system for high speed laser micro perforation and scribing of its printed packaging films.

The system has three scanning heads each with Rofin two-axis technology making it capable of perforations down to 0.1mm in size and in any pattern.  Lasers operate along and across the web to facilitate fast, complex and highly flexible designs of micro perforations.

The same system also scribes packaging films through one layer of laminated films which is designed for tear off strips, offers and separate sections while protecting the integrity of the contents.

TCL’s managing director Mike Golding said: “This new high-tech laser equipment will enable TCL to provide a much wider range of packaging solutions from one system. This will improve flexibility and turn round and increase our capacity by around 200%.

“We chose Rofin-Baasel as they are leaders in their field and had the technical skills and commitment to work with us to develop a system to our specification and one that will be integrated into existing slitting equipment at our Telford factory early in 2014.”

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